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Touch Screens

Touch Screens


Click on a product below for info:

AG-500 Silver Conductive Ink
Surface Resistivity: 0.02 Ω/■

Applications:
• Used for EL panels bus bars on ITO
• Touch screen bus bars
• Difficult substrates
• Flex circuits
• Membrane switches
• EMI/RFI shielding

Features:
• Screen printable
• Wets out well and has better adhesion on ITO substrates
• High conductivity
• Thin for spray or dipping
• Can blend with carbon to customize resistance

Click HERE to download the detailed AG-500 data sheet.
AG-510 Silver Conductive Ink
Surface Resistivity: 0.015 Ω/■

Applications:
• Membrane switches
• Additive circuits
• Printed Heaters
• PTF Circuits
• Defibrillator pads
• EKG/EEG Electrodes
• Blood glucose sensors
• EMI/RFI applications
• EL panels

Features:
• Polyester binder
• Screen or pad printable
• Fast drying
• High conductivity
• Thin for spray or dipping
• Can blend with carbon to customize resistance

Click HERE to download the detailed AG-510 data sheet.
C-200 Carbon Conductive Ink
Surface Resistivity: 50 Ω/■

Applications:
• Membrane switches
• Overprint for silver conductive traces
• Flex circuits
• Additive circuits

Features:
• Vinyl based thermoplastic
• Screen printable
• Excellent adhesion to polyester & polyimide substrates
• Not recommended on ITO
• Can be blended with AG-800 for specific resistance values
• Can be used as base electrode for EL panels

Click HERE to download the detailed C-200 data sheet.
C-774 Carbon Conductive Ink
Surface Resistivity: 30 Ω/■

Applications:
• Membrane switches
• Medical sensors
• Heaters
• Resistance pads
• Overprint for silver conductive traces printed on polycarbonate substrate

Features:
• Screen printable
• For use on polyester, polyimide and polycarbonate substrates
• Excellent adhesion to most metal surfaces
• Fast dry time in low temperature oven
• Rheology can be adjusted

Click HERE to download the detailed C-774 data sheet.
UV-3010 Conformal Coating/Encapsulant
Surface Resistivity: 3.8 x 1014 Ω/■

Applications:
• Component encapsulation
• Printed circuit board protection

Features:
• 100% solids
• Dot dispensable
• Moisture resistant
• Suitable for flexible substrates
• Can be sprayed or dipped

Click HERE to download the detailed UV-3010 data sheet.
UV-1006S Dielectric
Surface Resistivity: 2.9 x 1013 Ω/■

Applications:
• Printed insulation layers for circuits
• Touch screens
• El panels
• Flexible printed substrates

Features:
• 100% solids
• Adheres to difficult substrates such as ITO or other metal oxides
• Screen or pad printable

Click HERE to download the detailed UV-1006S data sheet.
EP-600 Two-part Silver Conductive Epoxy
Volume Resistivity: <2.9 x 10-3 Ω/-cm

Applications:
• Component or wire attachment
• Filling via holes or spacers

Features:
• Two-part electrically conductive epoxy
• Dot dispensable
• Low cure temperature
• Fast curing
• Suitable for flexible substrates
• 6 month shelf life
• Available in pre-measured CC-Paks, bulk or syringes

Click HERE to download the detailed EP-600 data sheet.
EP-900 Two-part Silver Stencil Epoxy
Volume Resistivity: <1.0 x 10-3 Ω-cm

Applications:
• Component attachment & termination on hybrid circuits, membrane keypads & other assemblies

Features:
• Two-part electrically conductive epoxy
• For stencil printing processes
• Low cure temperature
• Excellent bond strength, temperature resistance and toughness
• 6 month shelf life
• Available in pre-measured CC-Paks, bulk or syringes

Click HERE to download the detailed EP-900 data sheet.
EP-1100 One-part Silver Conductive Epoxy
Volume Resistivity: <5.0 x 10-4 Ω-cm

Applications:
• Component attachment & termination on hybrid circuits, membrane keypads & other assemblies

Features:
• One part epoxy
• 30-day shelf life
• Screen or stencil printing

Click HERE to download the detailed EP-1100 data sheet.
Sil-Con Two-part Potting Compound
Volume Resistivity: .06 Ω-cm

Applications:
• Gasket sealing for EMI/RFI shielding
• Flexible conductive interconnect between surfaces on touch screens & EL panels

Features:
• Very flexible & strong two-part component
• 100% solids
• Electrically conductive
• Temperature & solvent resistant
• Easy removal for component repair or replacement

Click HERE to download the detailed Sil-Con data sheet.
EP-837 Two-part Epoxy Staking Adhesive
Volume Resistivity: 1 x 1014 Ω-cm

Applications:
• Staking or anchoring components or wires
• Encapsulating components

Features:
• Low viscosity, 100% solids
• Non-conductive
• Dot dispensable
• Available in clear or green color
• Low temperature, fast curing

Click HERE to download the detailed EP-837 data sheet.