Conductive Compounds' advanced laboratory capabilities utilize state of the art equipment to evaluate and analyze raw materials and finished products.
On-site process evaluations
On-site process evaluations using digital microscopes, goniometers, IR thermometers & precision oven profiling equipment coordinated from a single portable laptop, can be easily conducted at a customer facility to evaluate process conditions and materials.
Tenney Environmental Test Chambers
The Tenney Environmental Test Chambers will test from -70 degrees C to 200 degrees C (-94 degrees F to 392 degrees F),and from 10% to 100% relative humidity. Controlled temperature and humidity cycling over time will simulate performance in the most extreme field conditions.
Fourier Transform Infrared (FTIR) Spectroscopy
Fourier Transform Infrared (FTIR) Spectroscopy uses light energy in the infrared spectra to identify unique characteristics of solids and liquids at the atomic level. Data collected from a scan is translated to an absorption graph across the entire infrared spectrum to identify organic and inorganic materials by their unique “fingerprint”. Multiple samples can be analyzed and compared, and any changes to a material, such as a slight chemical reaction or absorption of moisture, will be detected by FTIR.
Differential Scanning Calorimetry (DSC)
Differential Scanning Calorimetry (DSC) is a precise thermoanalytical method to detect minute changes in heat flow in or out of a sample as it is heated gradually or exposed to UV light to begin curing or to melt the sample. DSC provides glass transition temperature (Tg), thermal stability, melting point and crystallization temperature of a liquid or solid material, and to analyze cure rate and completeness of curing of thermoset polymers under different conditions.
Thermogravimetric Analysis (TGA)
Thermogravimetric Analysis (TGA) is a type of testing for monitoring weight loss at temperature to determine a material’s degradation temperature, moisture content, drying time and solids content.
Instron Tensile Tester
The Instron Tensile Tester is used to evaluate tensile, shear, compression and peel strengths of adhesive materials and solid films.
Scanning Electron Microscopy (SEM)
Scanning Electron Microscopy (SEM) produces three-dimensional, high-resolution images of materials at extremely high magnifications for evaluation of surface structure or cross-sections. X-ray diffraction, built into the SEM, provides the means to accurately identify specific elements in materials, and accurate analysis of amounts present within a given material.
Thermomechanical Analysis (TMA)
Thermomechanical Analysis (TMA) is a method for measuring a sample’s movement in response to temperature. TMA is use to measure glass transition temperature (Tg), mechanical deflection, modulus and heat distortion temperature and under a fixed mechanical load.
Goniometer
Our Goniometer provides digitally captured images of drops of liquids applied to substrates. From these images, contact angle can be accurately measured to determine how well a material wets out onto a substrate, which provides an indication of compatibility for adhesion. The goniometer can also measure key dimensions of a drop of liquid suspended from a precision tip so that surface tension of a liquid can be determined.
Electrical testing
Electrical testing capabilities include evaluation of insulation resistance up to 10,000 volts AC, capacitance & dielectric constant, and electric resistance from milliohms to Teraohms.
Rheology testing
Rheology testing allows accurate analysis of small samples under precise shear loads to determine how they will perform in print, dispense and other application methods.
Taber Linear Abrasion Testing
Taber linear abrasion testing is used to evaluate abrasion and wear performance of inks and coatings used in potentiometers and rheostats. This instrument applies a constant force using fixed weight, speed and stroke length for hundreds of thousands of cycles.
Optical microscopes
Optical microscopes capture high magnification digital images of samples. These images are used to analyze print characteristics, surface defects, contamination and mechanical failures in materials.